Sputtering is one of the PVD (physical vapor deposition) technology. It is one of the important methods to prepare thin film materials. It is characterized by the charged particles are accelerated in the electric field of the kinetic energy, will lead to the target ion electrode is made of sputtering material (cathode) method, and the sputtered target atoms along a certain direction to the substrate and deposited on substrate film. Magnetron sputtering is a special principle and common distribution in magnetron sputtering technique using the combination control of the magnetic field on electron trajectory in the electric field, thereby improving the sputtering process, the coating thickness and uniformity and compactness of the films is controllable, good preparation, strong adhesion and high purity. Magnetron sputtering has become an important means for the preparation of various functional films.
The technology of plasma dry etching is the technology of thin film micro processing using plasma. In the process of dry etching process in a typical one or more gas atoms or molecules are mixed in a reaction chamber, the influence of the external energy (such as RF and microwave plasma formation): active groups on one hand in the plasma etching on the surface of the material and the chemical reaction, generate volatile product ions; on the other hand in the plasma are accelerated in the guide and bias under the action of corrosion with directional etching surface and accelerated corrosion. The process of dry etching is the combination of chemical reaction and physical bombardment. Compared with the traditional wet etching technology, dry etching technology has been widely used in the field of microelectronic product manufacturing due to its good anisotropy and process controllability. Now it is gradually extended to LED, packaging and other ubiquitous IC fields.
