Sputtering technology belongs to PVD (Physical Vapor Deposition) technology and is one of the important methods for preparing thin film materials. It is characterized by the use of charged particles to accelerate a certain amount of kinetic energy in an electric field, directing ions to a target electrode (cathode) made of a substance to be sputtered, and sputtering the target atoms to make them follow a certain The method of moving to the substrate and finally depositing a film on the substrate. Magnetron sputtering combines the principle of magnetron with ordinary sputtering technology to control the electron trajectory in the electric field by using the special distribution of the magnetic field, thereby improving the sputtering process, making the thickness and uniformity of the coating controllable, and preparing the film. Good compactness, strong adhesion and high purity. Magnetron sputtering technology has become an important means of preparing various functional films.
The plasma dry etching technique is a technique for performing microfabrication of a film by using plasma. In a typical dry etching process, one or more gas atoms or molecules are mixed in the reaction chamber to form a plasma under external energy (such as radio frequency, microwave, etc.): on the one hand, the activity in the plasma The group chemically reacts with the surface material to be etched to form a volatile product; on the other hand, the ions in the plasma are guided and accelerated by the bias voltage to achieve directional corrosion and accelerated corrosion of the surface to be etched. The dry etching process is a combination of chemical reaction and physical bombardment. Compared with the traditional wet etching technology, the dry etching technology has been widely used in the field of microelectronics manufacturing due to its good anisotropy and process controllability. Nowadays, it is gradually extended to LEDs, packages and the like. IC field.
